Tag Archives: Smart Packaging Solutions

With SPS “Dual 6” Module, Smart Card Manufacturers Are Ready To Deliver Billion Cards Needed For The Upcoming Migration To Dual Interface Cards In The Americas

By | November 21, 2017

ROUSSET, FRANCE (PRWEB) NOVEMBER 22, 2017 Smart Packaging Solutions, a world leader in contactless and dual interface card manufacturing technologies, is proud to announce its “Dual 6” and “S-Lams®” technologies are ready for integration for smart card manufacturers to benefit from the massive upcoming migration to dual interface cards in the Americas. Already, leading financial institutions in the United… Read More »

SPS thinnest inlay brings additional security features to passport polycarbonate datapage

By | November 24, 2016

November 24, 2016 Smart Packaging Solutions (SPS) introduces one of the thinnest inlay in the world that expands into the hinge of a passport bringing new security features thanks to its ability to embed a specific image for each government while making the assembly easier for passport manufacturers. ROUSSET, FRANCE, November 24, 2016 – Smart Packaging Solutions, a… Read More »

SPS Validates ITW Brand Identity Division’s HoloLam Plus® for Dual Interface Transaction Cards

By | June 7, 2016

June 7, 2016 Following extensive testing performed by Smart Packaging Solutions’ (SPS) R&D Lab, ITW Brand Identity Division is proud to announce that its Premium and Advantage HoloLam Plus® full-face metallic and holographic laminates deliver EMV-like performance with dual interface transaction cards.   Chicago Heights, IL, USA and Rousset, France (PRWEB) June 06, 2016 Following extensive testing performed… Read More »