Tag Archives: infineon

Infineon and NEXT Biometrics Introduce Biometric Smart Card Reference Design

By | November 8, 2018

MUNICH, Germany and OSLO, Norway – November 8, 2018 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), the global leader in smart card payment solutions and NEXT Biometrics (Oslo Bors: NEXT), a global leader in fingerprint sensor technology, have joined together to create a reference design for biometric payment cards. The reference platform incorporates all necessary elements to develop… Read More »

Research: The Rise of Biometric Cards – Edition Q4 2018

By | October 16, 2018

This is a research about Biometric Smart Cards updated to October 2018. The data presented have been collected through various means, including interviews with company representatives, shareholders, researchers, developers, and people involved professionally in the smart card and biometric industry. The views and opinions expressed in this research are those of the authors and do not necessarily reflect the official… Read More »

Research: The Rise of Biometric Cards – Edition July 2018

By | July 19, 2018

This is a research about Biometric Smart Cards updated to July 2018. The data presented have been collected through various means, including interviews with company representatives, shareholders, researchers, developers, and people involved professionally in the smart card and biometric industry. The views and opinions expressed in this research are those of the authors and do not necessarily reflect the official… Read More »

Infineon gears up for stronger long-term growth

By | June 8, 2018

Infineon adjusts its target operating model to an investment-to-sales ratio of 15 percent aimed at generating revenue growth of 9 percent with a segment result margin prospectively in excess of 17 percent For the coming fiscal year at least, revenue is forecast to grow, at a minimum, by 10 percent Additional investments in manufacturing capacities are therefore planned… Read More »

Infineon – Supervisory Board extends CFO Dominik Asam’s contract to 2023

By | May 6, 2018

Munich, March 06, 2018 – The Supervisory Board of Infineon Technologies AG has extended the contract of Chief Financial Officer Dominik Asam by five years until December 31, 2023. Dominik Asam has been a member of the Management Board since January 1, 2011. His current contract expires on December 31, 2018. By extending his contract, the Supervisory Board… Read More »

Infineon expands mobile-security portfolio with the world’s fastest solution

By | February 26, 2018

Munich, Germany – 26 February  2018 – At the Mobile World Congress 2018 trade show in Barcelona, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced that it would be expanding its portfolio of mobile security solutions. The embedded Secure Element (eSE) product family now includes an entire system with Operating System (OS), applications and NFC modem wrapped… Read More »

Infineon – Alexander Foltin appointed Head of Investor Relations; Dr. Jürgen Rebel assumes responsibility for Embedded Security Solutions within the Chip Card & Security Division

By | January 16, 2018

Munich, Germany – 16 January 2018 – Alexander Foltin becomes Head of Investor Relations at Infineon Technologies AG, reporting to Chief Financial Officer Dominik Asam, effective 1 March 2018. Foltin will assume responsibility for the combined Finance, Treasury and Investor Relations team that will lead the communication to all financial stakeholders of Infineon: shareholders, analysts, banks, debt investors,… Read More »

Two “SESAMES Awards” for post-quantum cryptography on contactless security chip

By | November 29, 2017

Munich, Germany, and Cannes, France – 29 November 2017 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has been recognized with two SESAMES Awards for the world’s first post-quantum cryptography implementation on a contactless security chip. The prestigious industry awards were presented today at the TRUSTECH 2017 in Cannes. Infineon was awarded in two of six categories:… Read More »

New SECORA™ Pay brand: one-stop-offering for fast and easy production of payment cards and smart wearables

By | November 29, 2017

Munich, Germany and Cannes, France – 29 November 2017 – EMV®-compliant payment solutions face growing demand worldwide – with a clear path towards contactless and multifunctional use to increase user convenience. Under the brand SECORA™ Pay, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) bundles state of the art contact and dual-interface EMV* security controllers with the latest… Read More »

Coil on Module for contactless ID documents: complete solution with chip and antenna from a single source

By | November 27, 2017

Munich, Germany – 27 November 2017 – The core of electronic ID cards (eID) and passports are powerful and robust security solutions. Security chips in “Coil-on-Module” (CoM) packages offer significant advantages here. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is now expanding its internationally proven CoM portfolio with a complete solution for contactless ID documents. The new… Read More »

Infineon and Goldpac Sign Strategic Cooperation Agreement on Smart Manufacturing

By | September 13, 2017

September 13, 2017,Zhuhai, China—responding to China’s “Made in China 2025” strategy, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Goldpac (Stock Code: 03315) signed a strategic cooperation agreement today. The two sides reached a consensus that Infineon will help to further elevate the smart operation capabilities of Goldpac through the leveraging of their experience and knowledge of… Read More »

From payment to ticketing: contactless technologies are on the rise in smart cities

By | May 12, 2017

Munich, Germany, and Montreal, Canada – 12 May 2017 – Contactless card and touch-and-go mobile technology payments are on the rise: especially consumers and commuters in highly populated urban areas require higher transaction speeds and more convenience. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), the world leader for chip-based payment products, helps card and device manufacturers and… Read More »

NXP No.1 in MCU

By | April 28, 2017

The Freescale acquisition moved NXP from sixth in the 2015 MCU ranking to the top spot in 2016 with a marketshare of 19% ($2.9 billion). About three-quarters of NXP’s 2015 microcontroller sales were 8-bit and 16-bit MCUs used in smartcards. After Freescale’s business was merged into NXP, smartcard MCUs accounted for a little over one-quarter of the company’s… Read More »

Infineon invests S$105 million in Smart Factory

By | March 14, 2017

SINGAPORE: German semiconductor Infineon Technologies will invest S$105 million over the next five years into building a Smart Factory at its Singapore manufacturing facility. This is part of Infineon’s push to implement what it calls a Smart Enterprise Programme, encompassing horizontal, vertical and digital integration. For instance, it has introduced robots like automated guided vehicles, to facilitate the… Read More »

The J P Morgan Chase & Co Analysts Give Infineon Technologies AG (IFXA) a €18.00 Price Target

By | February 26, 2017

  J P Morgan Chase & Co set a €18.00 ($19.35) target price on Infineon Technologies AG (ETR:IFXA) in a report released on Monday morning. The firm currently has a buy rating on the stock. Other equities research analysts also recently issued research reports about the stock. Credit Suisse Group set a €17.50 ($18.82) target price on shares… Read More »

HID Global Partners with Infineon Technologies (IFX) to Enhance Card Flexibility for e-ID/Smart Card Manufacturers

By | February 21, 2017

News Highlights: Partnership with Infineon Technologies AG to incorporate secure microcontroller chips in new HID Global ultra-thin Polycarbonate (PC) ePrelaminate inlay solution. Ultra-thin PC ePrelaminate inlay is ideal for electronic ID (e-ID) cards and is more than 30 percent thinner than other alternatives, freeing space for added security features. Leverages patented HID DBond™ (Direct Bonding) technology for added… Read More »

Infineon – Structural Growth Drives Excellent Start To The New Fiscal Year

By | February 2, 2017

Feb 2, 2017 | Quarterly Report • Q1 FY 2017: Revenue €1,645 million; Segment Result €246 million; Segment Result Margin 15.0 percent; earnings per share €0.14 (basic and diluted); adjusted earnings per share €0.17 (diluted) • Outlook for Q2 FY 2017: Quarter-on-quarter revenue increase of 5 percent, plus or minus 2 percentage points, with Segment Result Margin of… Read More »

Masktech – EAL5+ FOR MTCOS PRO V2.2 ON INFINEON SLE78CLX

By | September 1, 2016

September 01, 2016 – The German BSI has issued a new Common Criteria EAL 5+ certificate for MTCOS Pro on Infineon SLE78CLX M7820 V2.Generally, Common Criteria is a strict standard to validate a product’s security, design process, development environment, functionality, security handling, testing and documentation. MTCOS Pro has been developed, evaluated and certified in Germany. The country is… Read More »