Tag Archives: Polycarbonate

HID Global Partners with Infineon Technologies (IFX) to Enhance Card Flexibility for e-ID/Smart Card Manufacturers

By | February 21, 2017

News Highlights: Partnership with Infineon Technologies AG to incorporate secure microcontroller chips in new HID Global ultra-thin Polycarbonate (PC) ePrelaminate inlay solution. Ultra-thin PC ePrelaminate inlay is ideal for electronic ID (e-ID) cards and is more than 30 percent thinner than other alternatives, freeing space for added security features. Leverages patented HID DBond™ (Direct Bonding) technology for added… Read More »