Tag Archives: Coil-on-Module

Coil on Module for contactless ID documents: complete solution with chip and antenna from a single source

By | November 27, 2017

Munich, Germany – 27 November 2017 – The core of electronic ID cards (eID) and passports are powerful and robust security solutions. Security chips in “Coil-on-Module” (CoM) packages offer significant advantages here. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is now expanding its internationally proven CoM portfolio with a complete solution for contactless ID documents. The new… Read More »